Soldering Soldering Brazing is a joining process whereby a non- ferrous filler metal and an alloy are heated to melting temperature (above 450 °C / 800°F) and distributed between two or more close-fitting parts by capillary action. At its liquid temperature, the molten filler metal interacts with a thin layer of the base metal, cooling to form an exceptionally strong, sealed joint due to grain structure interaction. The brazed joint becomes a sandwich of different layers, each metallurgically linked to each other. Common brazements are about 1/3 as strong as the materials they join, because the metals partially dissolve each other at the interface, and usually the grain structure and joint alloy is uncontrolled. To create high-strength brazes, sometimes a brazement can be annealed, or cooled at a controlled rate, so that the joint's grain structure and alloying is controlled. ...more on Wikipedia about "Brazing"
ColdHeat is an American company founded to develop and market products using the proprietary graphite-like compound it has named Athalite. The composite material has the unusual ability to conduct large amounts of heat and return to room temperature in a short amount of time. ...more on Wikipedia about "ColdHeat"
In electronics, desoldering is the removal of solder and components from a circuit for troubleshooting and repair purposes. Electronic components are often mounted on a circuit board and it is usually desirable to avoid damaging the circuit board, surrounding components, and the component being removed. ...more on Wikipedia about "Desoldering"
In metallurgy, flux is an aid to melting, a material which by its chemical action facilitates soldering or brazing of metals. Some common fluxes are ammonium chloride or rosin, for soldering tin; hydrochloric acid and zinc chloride for galvanized iron and other zinc surfaces; and borax, for brazing. ...more on Wikipedia about "Flux (metallurgy)"
Reflow soldering is the most common means to attach a surface mounted component to a circuit board, and typically consists of applying solder paste, positioning the devices, and reflowing the solder in a conveyorized oven. The goal of the reflow process is to melt the powder particles in the solder paste, wet the surfaces being joined together, and solidify the solder to create a strong metallurgical bond. There are usually four process zones in conventional reflow process, consisting of preheat, thermal soak (often shortened to just soak), reflow and cooling. ...more on Wikipedia about "Reflow soldering"
A solder is a fusible metal alloy (often of tin and lead, although lead-based solders were outlawed in many parts of the world in the 1980's), with a melting point or melting range below 450° C (840° F) and is melted to join metallic surfaces, especially in the fields of electronics and plumbing, in a process called soldering. ...more on Wikipedia about "Solder"
Solderability defines whether a solder can perform as intended in-service under normal fabrication methods or processes. The electronic industry has a consensus specification which provides guidelines for classifying, testing, marking, and packaging accepted solder compositions. ...more on Wikipedia about "Solderability"
Soldering is a method of joining metal parts using an alloy of low melting point ( solder) below 450 °C (800 °F). Heat is applied to the metal parts, and the alloy metal is pressed against the joint, melts, and is drawn into the joint by capillary action and around the materials to be joined by ' wetting action'. After the metal cools, the resulting joints are not as strong as the base metal, but have adequate strength, electrical conductivity, and water-tightness for many uses. Soldering is an ancient technique that has been used practically as long as humans have been making articles out of metal. ...more on Wikipedia about "Soldering"
A soldering iron is a device for applying a point source of heat to melt solder for soldering two materials together. Soldering irons are typically electrically powered. ...more on Wikipedia about "Soldering iron"
Wave Soldering is a large-scale soldering process by which electronic components are soldered to a printed circuit board (PCB) to form an electronic assembly. The name is derived from the fact that the process uses a tank to hold a quantity of molten solder; the components are inserted into or placed on the PCB and the loaded PCB is run across a pumped wave or cascade of solder. The solder wets to the exposed metallic areas of the board (those not protected with solder mask), creating a reliable mechanical and electrical connection. The process is much faster and can create a higher quality product than manual soldering of components. ...more on Wikipedia about "Wave soldering"
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